A Thermal Wall is Forming

Higher component power density translates to significant increases in heat generation. As power per area increases, heat generation per area increases at a faster rate.

Current cooling technologies cannot manage rising heat densities. New solutions are needed to break through the Thermal Wall and allow data/compute increases to continue.

Accelsius Breaks Through

With a revolutionary new approach to cooling,
Accelsius technology is designed to break through the Thermal Wall.

COMPONENTS

Newer, higher performance chips are driving increased heat dissipation. We are heading for the 1000 Watt CPU.

EQUIPMENT

More powerful servers, routers, switches, cell tower base stations, etc. require improved systems level cooling.

SYSTEMS

Denser racks of equipment are dissipating more heat per unit area than ever.

FACILITIES

Heat management capacity of data center and telecom facilities have exceeded the capabilities of current cooling technologies.

2022
Standing out by simply saying less
2021
Better Outcomes for All
2020
Illustrating brand values for a tech giant
2019
Best Web Design Trends
2018
International Design Awards

Awards

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