A Thermal Wall is Forming

Higher component power density translates to significant increases in heat generation. As power per area increases, heat generation per area increases at a faster rate.

Current cooling technologies struggle with rising heat densities. New solutions that are practical are needed to break through the Thermal Wall and allow data/compute increases to continue.

Accelsius Breaks Through

With a revolutionary new approach to cooling,
Accelsius technology is designed to break through the Thermal Wall.


Newer, higher performance chips are driving increased heat dissipation. We are heading for the 1000 Watt CPU.


More powerful servers, routers, switches, cell tower base stations, etc. require improved systems level cooling.


Denser racks of equipment are dissipating more heat per unit area than ever.


Heat management capacity of data center and telecom facilities are pushing the limits of current cooling technologies.

Standing out by simply saying less
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