DIRECT TO CHIP
The cold plate sits in direct contact with the heat source, driving optimal heat transfer.
TWO-PHASE
The transition from liquid to vapor maximizes heat dissipation.
PASSIVE
There's no need for a pump to circulate the dielectric working fluid.
HEAT REJECTED TO SECONDARY SIDE
HEAT REMOVED BY DIRECT CONTACT
WITH COLD PLATE
WITH COLD PLATE
PLATE IS IN
DIRECT CONTACT
WITH HEAT SOURCE
DIRECT CONTACT
WITH HEAT SOURCE
Accelsius solutions are
highly scalable
highly scalable
To entire facilities
