Introducing Accelsius, designed to deliver the highest performing cooling solution for servers, routers, switches, cell tower base stations, and other critical electronics platforms.
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Accelsius technology is engineered to deliver unprecedented densification, efficiency, scalability, and sustainability.
Positioned to shatter the Thermal Wall as power and heat densities increase, it future-proofs your IT business and allows you to scale to meet global data and compute demand.
DIRECT TO CHIP
The cold plate sits in direct contact with the heat source, driving optimal heat transfer.
TWO-PHASE
The transition from liquid to vapor maximizes heat dissipation.
PASSIVE
There’s no need for a pump to circulate the dielectric working fluid.
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Our elegant cooling design has been created to maximize capacity, reduce operating costs, and increase energy efficiency for data centers and telecom/5G applications for today and tomorrow.
